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[Announcement] Plant Renovation Project on Behalf of Subsidiary JingCheng Materials Co., Ltd.
Date: December 26, 2024 Company: BoardTek (3518) Subject: Plant renovation project carried out on behalf of subsidiary JingCheng Materials Co., Ltd. Spokesperson: Liu Ming-Yi Description: 1. Name and nature of the subject matter (e.g., land located at XX Section, XX Sub-section, North District, Taichung City): Plant works and equipment. 2. Date of occurrence: 2024/12/26 – […]
BoardTek Board Approves Additional Capital-Expenditure Budget for Subsidiary JingCheng Materials, Plans NT$1.463 Billion Investment
Material Information Disclosure on the Market Observation Post System (3518) BoardTek—Announcement that the Company’s Board of Directors approved a capital expenditure budget for its subsidiary 1. Date of resolution by Board of Directors or Shareholders’ Meeting: 2023/11/08 2. Investment plan: The Company’s Board of Directors approved an additional capital-expenditure budget for the subsidiary JingCheng Materials […]
BoardTek Enters Silicon Carbide Field, Acquires Majority Stake in JingCheng Materials to Pave the Way for Transformation
[CMoney News / Reporter Wang Yi-Hung] BoardTek (3518) announced its entry into the silicon carbide (SiC) field by acquiring a majority stake in JingCheng Materials, while also placing 16,000 privately offered shares to be subscribed by the JingCheng team to deepen the partnership. BoardTek stated that the acquisition is intended to pave the way for […]
High Aspect-Ratio Glass-Substrate Via-Fill Electroplating and Inspection Technology
ITRI’s “High Aspect-Ratio Glass-Substrate Via-Fill Electroplating and Inspection Technology” effectively increases electrode density and improves chip stacking, helping Taiwan’s semiconductor industry continue to lead. The image depicts advanced fan-out packaging—a domain where this technology can be applied. Glass-Interposer technology brings 2D-to-3D advanced packaging with more stable yields and more competitive cost. As semiconductor processes continue […]
Technology Trends in AI Packaging Materials
As demand for AI computing continues to surge, chip design is moving toward higher bandwidth, lower latency, and greater integration, making packaging technology a critical determinant of AI hardware performance. Die-to-die interconnect technologies—Redistribution Layers (RDL), hybrid bonding, and Through-Silicon Vias (TSV)—not only boost signal transmission efficiency and density but also enable multi-die architectures in high-performance […]