Application

PVD Magnetron Sputtering — Principle

Description

Physical Vapor Deposition (PVD). In a sealed chamber, vacuum pumps create a stable vacuum; a gas supply introduces inert gas (typically Ar). High voltage discharges across the magnetron target surface, generating plasma. Ionized gas ions are attracted to the negatively biased target surface and bombard it, sputtering target atoms which travel downward and deposit on the substrate. The entire deposition occurs through physical collisions between Ar ions and the target — hence “Physical Vapor Deposition”.

PVD Ti-Cu Seed-Layer Line

Description

BGA carriers, ceramic substrates and PI flex boards require fine-line and micro-via solutions, and advanced circuit applications demand good copper adhesion — driving demand for vacuum-sputtered copper seed layers.
The vacuum in-line coating line covers pump-down, moisture removal, pre-treatment, and Ti-Cu deposition end-to-end. Seed-layer deposition is monitored as the essential base for subsequent copper plating.

BoardTek Advantages
Modular design: the sputter line can be configured per site, capacity and film requirements, with future-flexible adjustment.
Coating technical support: BoardTek joins development testing when new-material coating needs arise.

Equipment Features
Low-temperature sputter throughout — no substrate deformation.
High adhesion (Ti layer) and high conductivity (Cu layer).
High-throughput process.
Substrate surface activation by pre-treatment for excellent film adhesion.
Film-thickness uniformity U% 5–10% (varies by requirement).

Applications
Various carriers such as ABF, glass, and SiC.

General-purpose Multi-function Horizontal Sputter Line
Item	Specification	Unit	Notes
Equipment Length	L 25 × W 3.2 × H 1.5	M
Equipment Weight	25	t
Footprint	L 30 × W 5.0 × H 3.5	M	Overhead crane required
Target Configuration	8	Sets
Trolley Size	1250 × 700	Sets
Max Loading Height	65	mm
Cycle Time	Per customer requirements	Sec
Equipment Capability
Producible Film Materials	Metal films such as Cu, SUS, Al, Cr, Ti, NiCr; non-metal reactive films negotiable.
Applicable Industries	Ceramic substrates, TGV glass, 3C surface films, film-type products.

EMI Horizontal Coating Line

Description

Notebook PCB enclosures and components such as CPU/RAM/Wi-Fi can leak EM radiation during high-frequency operation, so notebook plastic enclosures require interior EM shielding. Vacuum-sputter deposition of metal films is an eco-friendly, energy-saving and effective shielding approach.Coating jigs are used to mask off non-coating areas; jigs and parts enter the sputter line together for low-temperature deposition.

BoardTek Advantages

Process volume-production experience:
BoardTek has extensive experience integrating upstream and downstream processes for EMI coating, surface coating and decorative film coating.
Modular design:
the sputter line can be configured per site, capacity and film requirements, with future-flexible adjustment.
Coating technical support:
BoardTek joins development testing from the earliest stage for new-substrate coating needs.

Equipment Features

Low-temperature sputter process; no enclosure deformation.
Cycle time configurable per customer needs; future technical upgrades can increase capacity.
Trolley auto-return system saves shop-floor space.
Highly customizable — flexible equipment configurations based on substrate size and process requirements.

Applications

Functional films:EMI coating processes, thermal films.
Decorative films:PC/PET films (internal metallic decorative film), 3C enclosure exteriors, etc.

EMI Horizontal Sputter Line
Item	Specification	Unit	Notes
Equipment Length	L 25 × W 3.2 × H 1.5	M
Equipment Weight	25	t
Footprint	L 30 × W 5.0 × H 3.5	M	Overhead crane required
Target Configuration	8	Sets
Trolley Size	1250 × 700	Sets
Max Loading Height	65	mm
Cycle Time	40	Sec
Equipment Capability
Producible Film Materials	Metal films such as Cu, SUS.
Applicable Industries	EMI electromagnetic shielding films.

Aluminum-Alloy Wheel Coating Line

Description

Conventional chrome electroplated wheels raise environmental concerns and add weight, so vacuum-coating has emerged as an eco-friendly replacement.
BoardTek designed an automated coating line with automated transfer equipment. After the paint-bake line, wheels are auto-gripped to coating trolleys, conveyed into the line for vacuum coating, then quickly discharged into the return line and transferred by robotic arm to the topcoat line for clearcoat application.
Reduced labor throughout, easy process control — the top choice for aluminum-alloy and forged-wheel sputter coating.

BoardTek Advantages
Production-machine experience:
BoardTek has production experience in wheel coating and upstream/downstream painting and offers corresponding process technology transfer.
Modular design:
the sputter line can be configured per site, capacity and film requirements, with future-flexible adjustment.
Coating technical support and problem-solving:
BoardTek provides experience-based support for development and volume production issues.

Equipment Features
Clean line layout; easy maintenance.
Eco-friendly metal-coating process; no polluting wastewater or exhaust — replaces wet electroplating.
Built-in plasma surface pre-treatment for excellent film adhesion.
Trolley auto-return system can integrate with upstream/downstream paint lines via robotic loaders/unloaders to streamline labor.

Applications
Suitable for cast aluminum-alloy and forged wheel surface-coating processes.

Wheel Coating Line
Item	Specification	Unit	Notes
Equipment Length	L 13 × W 2.8 × H 2.4	M
Equipment Weight	26	t
Footprint	L 30 × W 5.0 × H 3.5	M
Target Configuration	Per customer requirements	Sets
Trolley Size	16–24 inch wheels	Sets	Chamber opening 90 × 55 cm
Cycle Time	Per customer requirements	Sec
Equipment Capability
Producible Film Materials	Metal films such as Al, Cr, Ti, NiCr.

Product and Technology

Application

PVD Magnetron Sputtering — Principle

Description

PVD Ti-Cu Seed-Layer Line

Description

EMI Horizontal Coating Line

Description

Aluminum-Alloy Wheel Coating Line

Description

Other Product

Advanced Semiconductor Packaging

OEM Services

SiC Patents

Vacuum Sputtering Patents

SiC Processing

Functional Coatings

Thermal Materials

Equipment & Technical Services

Thermal Coatings

Advanced Semiconductor Packaging

OEM Services

SiC Patents

Vacuum Sputtering Patents

SiC Processing

Functional Coatings

Thermal Materials

Equipment & Technical Services

Thermal Coatings